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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Lead Free Implementation

Standard NiPdAu
Thin NiPdAu
Micro NiPdAu
Advanced Micro NiPdAu
RT Advanced Micro NiPdAu
4 Layer PPF

4 Layer PPF

Au
0.2µ"
Au
8µ"
Pd
0.5µ"
Ni
20µ"
  • Low cost solution for Cu wire boundary.
  • Enhanced solderability performance.
  • Increase Cu wire bonding machine utilization and throughput.