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New Process & Technology

High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

MSL Improvement

MEP Process
Photo Resist Plating

What is NEAP?

  • "NEAP" means Non Etch Ag Prep.
  • "NEAP" is the Non Etch Ag Prep onto leadframe surface.
  • Enhance Ag and Cu adhesion to mold compound through Ag Oxide to improve MSL performance.
  • Low cost MSL solution.



  • NEAP MSL performance on Ag plated surface and copper plated surface are good as it uses Ag oxide to enhance mold compound adhesion.
  • No delamination found at MSL 1 for NEAP, on 5x5 QFN.
  • NEAP sample visual appearance is slightly different than normal plated leadframe (slight silverish).