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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Lead Free Implementation

Standard NiPdAu
Thin NiPdAu
Micro NiPdAu
Advanced Micro NiPdAu
RT Advanced Micro NiPdAu
4 Layer PPF

Advanced Micro NiPdAu

Std NiPdAu Advanced Micro NiPdAu
(Samsung Micro PPF Technology)
Au
0.2µ"
Pd
1.8µ"
Ni
25µ"
AuAg
0.8µ"
Pd
0.5µ"
Ni
20µ"
  • Samsung Patented Advanced Micro NiPdAu plating process.
  • Enhanced MSL performance.
  • Corrosion free for Alloy 42 material.
  • Excellent solderability.
  • Epoxy bleed free.