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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Improved Thermal / Electrical Performance

Deep Downset Capability
QFN Deep Downset
QFN Taping

Deep Downset Capability

Exposed Die Pad Package
Deep Downset Capability

Exposed Die Pad Package

Deep Downset

  • Exposed Die Pad package is a package where the die pad is deep downset to expose the bottom die pad outside the mold compound to improve package thermal performance.
  • DCI invested in 25-Ton downset equipment to enhance deep downset capability.
  • Machine capable to handle up to 90mm X 280mm leadframe size

Lead Frame - Front

Lead Frame - Back

lead frame - front lead frame - back