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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Improved Thermal / Electrical Performance

Deep Downset Capability
QFN Deep Downset
QFN Taping

Deep Downset Capability

Exposed Die Pad Package
Deep Downset Capability

Deep Downset Capability

Dynacraft deep downset capability provides our customers with packaging solutions of superior electrical and thermal performance with high reliability.

Deep Downset Capability

Ratio (Downset Depth vs Thickness) : 2.8X - 5.6X
Tolerance : ± 1 Mils

Example of Deep Downset Packages

Package Type

Ld Count

Material Thickness (mils)

Material Type

Downset Depth (mils)

Tolerance (mils)

Ratio (D/set depth vs Thickness)

Tiebar width (mils)

V-notch width (mils)

D/set angle (degree)

TQFP 64 Lds 5 C7025 27.B ± 1 5.6X 15.7 N/A 35
QFP 52 Lds 6 C7025 / EFTEC64T 27 ± 1.5 4.5X 7.9 5 30
QFP 44 Lds 6 EFTEC64T 19 ± 1 3.1X 7.9 5 45
TSSOP 16/20 Lds 5 C7025 18 ± 1 3.6X 9 N/A 45
SSOP 28 Lds 8 C151 25 ± 1 3.1X 14 N/A 45
QSOP 28 Lds 8 C194 29 ± 2 3.5X 12 8 30
SONB 8 Lds 8 C194 27 ± 1 3.4X 10 N/A 35
SONB 8 Lds 8 C194 25.5 ± 1 3.2X 10.1 8 45
MSOP 8/10 Lds 6 C194 16.5 ± 1 2.8X 5 N/A 45
MSOP 10 Lds 6 C7025 16.5 ± 1 2.75x 7 N/A 60