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Operations

Quality Control
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Manufacturing

Manufacturing

Etching
Plating
Backend

Etching

DCI Etching Line

DCI Etching Line

  • Machine installed in Nov 2006
  • Mass production started in Jan 2007
  • Increase overall etching capacity by 30 ~ 40%
  • Higher productivity through wider copper width (260 mm)
  • Increase QFP capability up to 150 micron ILP for 5 mils thickness
  • More precise exposing process with less human dependant through 6 camera vision system
  • More consistent etching process with less uniformity issue
Pre-Clean Laminate

Pre-Clean

Laminate

Dev-Etch Expose

Dev-Etch

Expose