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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Lead Free Implementation

Standard NiPdAu
Thin NiPdAu
Micro NiPdAu
Advanced Micro NiPdAu
RT Advanced Micro NiPdAu
4 Layer PPF

Micro NiPdAu

Std NiPdAu Micro NiPdAu
(Samsung Micro PPF Technology)
Au
0.2µ"
Pd
1.8µ"
Ni
25µ"
Au
0.2µ"
Pd
0.5µ"
Ni
20µ"
  • Samsung licensed Patented Pre-treatment process.
  • Very thin Pd thickness (min 0.5µ").
  • Standard 3 layer plating layer structure.
  • Excellent solderability.