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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Miniaturization

Ultra Thin Package
Package Trend Towards Miniaturization
QFN Taping

Miniaturization

Due to the increasing demand for miniturization products, DCI has developed various technologies to meet those requirements.

miniaturization
Ultra Thin Package Package Trend Towards Miniaturization QFN Taping