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Manufacturing

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Plating

MEP
NiPdAu PPF
Reel to Reel Horizontal Plating Machine
Strip to Strip Plating Machine
Photo Resist Plating Machine

MSL Enhancement Process (MEP)

MEP MEP

  • Developed this process in 2002. Mass production started in Apr 2003.
  • This process was developed to enhance MSL performance of leadframe based packages by roughening the copper surface of the leadframe.
  • Compatible with major Cu alloy (including C7025).
  • No major impact on Ag surface.
  • Capable of improving MSL performance of existing material set by 1 level minimum.