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SO Package

Quad Flat No leads package (QFN)


QFN is the fastest growing package in the industry due to its near CSP design with excellent electrical and thermal performance. DCI had been producing QFN frame in mass production since year 2000. Since then DCI had produced millions of QFN leadframes and over 1000 different part number for various customer. Capable to plate with spot Ag, ring plate (single, double or triple) or NiPdAu (Standard, Micro or Advanced Micro). Also available with MSL Enhancement Process (MEP) for better MSL performance. Capable to provide with or without taping (both Silicone adhesive type eg Nitto, 3M or Thermoplastic type eg Hitachi).