DCI logo
navigation bar
About Us Operations Products New Process & Technology Contact Us Sitemap

New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Improved Thermal / Electrical Performance

Deep Downset Capability
QFN Deep Downset
QFN Taping

QFN Deep Downset

Required deep downset to expose the die pad to the top surface of the package.