DCI logo
navigation bar
About Us Operations Products New Process & Technology Contact Us Sitemap

Site Map

Home

Site Map

About Us
     ⇒ History
     ⇒ Major Events
     ⇒ Organizational Structure
     ⇒ Company Vision and Business Structure

Operations
     ⇒ Quality Control
     ⇒ Engineering
     ⇒ Manufacturing
            » Etching
                 ⊕ DCI Etching Line
            » Plating
                 ⊕ MEP
                 ⊕ NiPdAu PPF
                 ⊕ Reel to Reel Horizontal Plating Machine
                 ⊕ Strip to Strip Horizontal Plating Machine
                 ⊕ Photo Resist Plating Machine
            » Backend
                 ⊕ AVI Machine
                 ⊕ QFP 4 Segment Taping Machine
                 ⊕ Nitto/3M Tape Taping Machine
                 ⊕ Hitachi Tape Taping Machine

Products
     ⇒ Small Outlines Package
     ⇒ Quad Flat Package
     ⇒ Quad Flat No Leads Package

New Products & Technology
     ⇒ Miniaturization
            » Ultra Thin Package
            » Packaging Trend Towards Miniaturization
            » QFN Taping
     ⇒ High Density
            » High Density Matrix Leadframe
            » 1 MAP QFN Development
            » QFN Taping
            » Matrix Taping
     ⇒ Improved Thermal Performance
            » Deep Downset Capability
                 ⊕ Exposed Die Pad Package
                 ⊕ Deep Downset Capability
            » QFN Deep Downset
            » QFN Taping
     ⇒ Lead Free Implementation
            » Standard NiPdAu
            » Thin NiPdAu
            » Micro NiPdAu
            » Advanced Micro NiPdAu
     ⇒ MSL Improvement
            » MEP Process
            » Photo Resist Plating

Contact Us
     ⇒ Contact Information
            » Malaysia
     ⇒ Location Map
            » Airport to DCI
            » Penang Bridge to DCI
     ⇒ Enquiry Form
     ⇒ Career at DCI