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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Lead Free Implementation

Standard NiPdAu
Thin NiPdAu
Micro NiPdAu
Advanced Micro NiPdAu
RT Advanced Micro NiPdAu
4 Layer PPF

Standard NiPdAu

Au
0.2µ"
Pd
1.8µ"
Ni
25µ"
  • Standard 3 layer plating process.
  • Thin Au flash to enhanced solderability performance.
  • Reliable plating quality.
  • Production over billion parts.