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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Improved Thermal / Electrical Performance

Deep Downset Capability
QFN Deep Downset
QFN Taping

Improved Thermal/Electrical Performance

Due to high power requirements on IC, customers are moving towards expose pad or flag which requires deep downset or QFN Taping. All thermally/electrically enhanced leadframe technology based packages offered by DCI have excellent heat dissipation and electrical grounding to the Printed Wiring Board.

improved thermal performance
Deep Downset Capability QFN Deep Downset QFN Taping