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New Process & Technology

Miniaturization
High Density
Improved Thermal / Electrical Performance
Lead Free Implementation
MSL Improvement

Miniaturization

Ultra Thin Package
Package Trend Towards Miniaturization
QFN Taping

Ultra-Thin QFN Package

  • Leadframe thickness as thin as 5mils with half-etching requirement.
  • Big challenge to plate such package with conventional rubber masking process as the frame will be too weak for mechanical contact. Photo-resist plating technology without mechanical contact & minimize handling will be the ideal plating process for such package.
  • Use half-etch and protective bar technology to ensure that the die attach pad do not warp.

Strip view

Front view

Back view